Thermal Effects Module – Basic
The basic thermal module produces information useful for computing heat generation rate and crack growth rate law sensitivity to temperature. Use for cases involving significant self-heating and/or thermal gradients (ie Δθ > 25°C).
Recommended for cases with self-heating or thermal gradients.
User gives 2 (additional to FPM-C) temperatures between -40°C & 150°C.
It is required to run FPM-C in order to run this Module.
Experiment Overview:
- static tearing raw data at 2 temperatures (in addition to the temperature run in FPM-C)
- cyclic stress strain raw data at 1 temp., 1 frequency, 5 strain levels
- number of slabs needed for test: 3
Thermal Effects Module -K/WLF
This module is used to determine the strain, temperature and frequency dependence of the viscoelastic storage and loss modulus for use in thermal-mechanical analysis with temperature effects and energy dissipation, or self-heating considerations. The K/WLF module is named for Kraus and for Williams-Landel-and-Ferry, two representations used to describe viscoelastic DMA (Dynamic Mechanical Analysis) measurements. Supports thermal-mechanical workflows for product temperature and energy dissipation analysis.
Experiment Overview:
- low Strain Frequency Sweeps at 3 temperatures
- low Strain Temperature Sweep
- strain Sweep – initial and repeat – at specified temperature and frequency
- optional thermal conductivity, specific heat and density
- three replicates of each test
- number of slabs needed for test: 4